Product features
|
Layers |
2 Layers
|
Material |
H150LF
|
|
Plate Thickness |
2.00±0.20mm
|
Minimum Finished Aperture： |
Through Hole孔：0.35MM |
|
Line width/Line spacing |
Outer layer 152/142um |
Solder Mask |
Green |
| Text Layer | White |
|
|
Product application display
Product lamination and slicing
